서우테크놀로지(주)

Semiconductor packages consist of various materials with different physical properties and grinding characteristics.

By applying the appropriate grinding wheel and processing conditions for each material, we achieve uniform grinding across composite materials.

Thickness variations across different areas of a package can affect product quality and subsequent processes.

By achieving the target thickness and TTV, we ensure consistent and reliable processing quality.

Surface condition after grinding is a critical factor in meeting product specifications.

Through optimized processing conditions, we consistently achieve surface roughness that meets material characteristics and required specifications.